低应力强度疲劳裂纹扩展的某些问题
刘迨
摘要(Abstract):
本文介绍了国外近年来在低应力强度疲劳裂纹扩展(LFCP)研究方面的一些情况,着重介绍了应力比R、材料强度、晶粒度和环境介质对LFCP的影响。当提高只或材料强度时,均可增加LFCP的da/dN 和降低(?)K_(tho)对铁素体-珠光体钢,粗化晶粒可以减少da/dN提高(?)K_(tho)对马氏体钢,晶粒度具有相反的影响。多数试验表明,在真空和惰性环境下可以降低LFCP的da/dN和提高(?)K_(tho)文章的后一部分,介绍了两个有关LFCP的模型。高强度钢的氢脆模型,把R、σ_y表征组织因素尺寸的ρ~*以及环境因素,对LFCP的影响联系起来了。应力松弛和循环蠕变模型,则解释了△K_t和△K_(th)的本质,并且说明了从大量试验归纳出来的△K_(ht)=0.7△K_t的简单定量关系。
关键词(KeyWords):
基金项目(Foundation):
作者(Author): 刘迨
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